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 MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Advance Information
MC74HC10A
N SUFFIX PLASTIC PACKAGE CASE 646-06
1
Triple 3-Input NAND Gate
High-Performance Silicon-Gate CMOS
The MC74HC10A is identical in pinout to the LS10. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. * * * * * * Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2 to 6 V Low Input Current: 1 A High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements Defined by JEDEC Standard No. 7A * Chip Complexity: 36 FETs or 9 Equivalent Gates LOGIC DIAGRAM
1 2 13 3 4 5 9 10 11 8 Y3 6 Y2 Y = ABC 12 Y1
14
14 1
D SUFFIX SOIC PACKAGE CASE 751A-03
14 1
DT SUFFIX TSSOP PACKAGE CASE 948G-01
ORDERING INFORMATION MC74HCXXAN MC74HCXXAD MC74HCXXADT Plastic SOIC TSSOP
A1 B1 C1 A2 B2 C2 A3 B3 C3
PIN ASSIGNMENT
A1 B1 A2 B2 C2 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VCC C1 Y1 C3 B3 A3 Y3
PIN 14 = VCC PIN 7 = GND
Y2 GND
FUNCTION TABLE
Inputs A L X X H B X L X H C X X L H Output Y H H H L
This document contains information on a new product. Specifications and information herein are subject to change without notice. 12/97
(c) Motorola, Inc. 1997
1
REV 0
MC74HC10A
II I II I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIII IIIIIIIIIIIIIIIIIIIIIII I I II I I I II I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I III I I I III I I I I I I II I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIII IIIIIIIIIIIIIIIIIIIIIII I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I III I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I I I I I I II I I I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I III I I I I I I II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I IIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIII I IIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII II I I III I IIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I III I I III I IIIIIIIIIIIIIIIIIIIIIII III IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I I IIIIIIIIIIIIIIIIIIIIIII III II I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIII I I
IIIIIIII I I II I IIIIIIIIIIIIIIII II I I I IIIIIIIIIIIIIIIIIIIIII I I III I I I I I II IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I III I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII IIIIII I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII
MAXIMUM RATINGS*
Symbol VCC Vin Parameter Value Unit V V V DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) - 0.5 to + 7.0 - 0.5 to VCC + 0.5 - 0.5 to VCC + 0.5 20 25 50 750 500 450 Vout Iin DC Output Voltage (Referenced to GND) DC Input Current, per Pin mA mA mA Iout DC Output Current, per Pin ICC PD DC Supply Current, VCC and GND Pins Power Dissipation in Still Air Plastic DIP SOIC Package TSSOP Package mW Tstg TL Storage Temperature - 65 to + 150 260
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
v
v
_C _C
Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP, SOIC or TSSOP Package)
* Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. Derating -- Plastic DIP: - 10 mW/_C from 65_ to 125_C SOIC Package: -7 mW/_C from 65_ to 125_C TSSOP Package: - 6.1 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol VCC Parameter Min 2.0 0 Max 6.0 Unit V V
DC Supply Voltage (Referenced to GND)
Vin, Vout TA
DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature, All Package Types Input Rise and Fall Time (Figure 1)
VCC
- 55 0 0 0 0
+ 125 1000 600 500 400
_C
ns
tr, tf
VCC = 2.0 V VCC = 3.0 V VCC = 4.5 V VCC = 6.0 V
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
S bl Symbol VIH
P Parameter
T Test C di i Conditions
VCC V 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 4.5 6.0 3.0 4.5 6.0
- 55 to 25_C 1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 1.9 4.4 5.9
v 85_C v 125_C
1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 1.9 4.4 5.9 1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 1.9 4.4 5.9
Ui Unit V
Minimum High-Level Input Voltage
Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A
v v v
VIL
Maximum Low-Level Input Voltage
Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A
V
VOH
Minimum High-Level Output Voltage
Vin = VIH or VIL |Iout| 20 A
V
Vin = VIH or VIL |Iout| |Iout| |Iout|
v 2.4 mA v 4.0 mA v 5.2 mA
2.48 3.98 5.48
2.34 3.84 5.34
2.20 3.70 5.20
MOTOROLA
2
High-Speed CMOS Logic Data DL129 -- Rev 6
MC74HC10A
III I I I I I II I II I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I II I I II I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I I II I I I I IIIIIIIIIIII I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I II I I I II I I II I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I III I I I I I I II I I II I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIII I I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit Symbol VOL Parameter Test Conditions VCC V 2.0 4.5 6.0 3.0 4.5 6.0 6.0 6.0 - 55 to 25_C 0.1 0.1 0.1
v 85_C v 125_C
0.1 0.1 0.1 0.1 0.1 0.1 0.33 0.33 0.33 0.40 0.40 0.40
Unit V
Maximum Low-Level Output Voltage
Vin = VIH |Iout| 20 A
v
Vin = VIH or VIL |Iout| |Iout| |Iout| Vin = VCC or GND Vin = VCC or GND Iout = 0 A
v 2.4 mA v 4.0 mA v 5.2 mA
0.26 0.26 0.26
Iin
Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package)
0.1 1
1.0 10
1.0 40
A A
ICC
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)
Guaranteed Limit
Symbol S bl tPLH, tPHL
Parameter P
VCC V 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 --
- 55 to 25_C 95 45 19 16 75 30 15 13 10
v 85_C v 125_C
120 60 24 20 95 40 19 16 10 145 75 29 25 110 55 22 19 10
Unit Ui ns
Maximum Propagation Delay, Input A, B, or C to Output Y (Figures 1 and 2)
tTLH, tTHL
Maximum Output Transition Time, Any Output (Figures 1 and 2)
ns
Cin
Maximum Input Capacitance
pF
NOTES: 1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). 2. Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). Typical @ 25C, VCC = 5.0 V CPD P Di i i Capacitance (P G )* i Power Dissipation C (Per Gate)* 25
F pF
* Used to determine the no-load dynamic power consumption: P D = C PD V CC 2 f + I CC V CC . For load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). tf 90% INPUT 50% A, B, OR C 10% OUTPUT Y 90% 50% 10% tTLH tTHL tr TEST POINT VCC GND tPLH tPHL DEVICE UNDER TEST OUTPUT CL*
* Includes all probe and jig capacitance
Figure 2. Test Circuit
A Y B C
Figure 1. Switching Waveforms
EXPANDED LOGIC DIAGRAM (1/3 OF THE DEVICE)
High-Speed CMOS Logic Data DL129 -- Rev 6
3
MOTOROLA
MC74HC10A
OUTLINE DIMENSIONS
N SUFFIX PLASTIC DIP PACKAGE CASE 646-06 ISSUE L
B
1 7
14
8
NOTES: 1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 4. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M N INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.300 BSC 0_ 10_ 0.015 0.039 MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.62 BSC 0_ 10_ 0.39 1.01
A F C N H G D
SEATING PLANE
L
J K M
-A-
14 8
D SUFFIX PLASTIC SOIC PACKAGE CASE 751A-03 ISSUE F
-B-
1 7
P 7 PL
0.25 (0.010)
M
B
M
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
G C
R X 45
F
SEATING PLANE
D
14 PL
K
M
M B
S
J
0.25 (0.010)
T
A
S
DIM A B C D F G J K M P R
MILLIMETERS MIN MAX 8.75 8.55 4.00 3.80 1.75 1.35 0.49 0.35 1.25 0.40 1.27 BSC 0.25 0.19 0.25 0.10 7 0 5.80 6.20 0.25 0.50
INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 7 0 0.228 0.244 0.010 0.019
MOTOROLA
4
High-Speed CMOS Logic Data DL129 -- Rev 6
MC74HC10A
OUTLINE DIMENSIONS
DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948G-01 ISSUE O
14X K REF NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_
0.10 (0.004) 0.15 (0.006) T U
S
M
TU
S
V
S
N
2X
L/2
14
8
0.25 (0.010) M
L
PIN 1 IDENT. 1 7
B -U-
N F DETAIL E K K1 J J1
0.15 (0.006) T U
S
SECTION N-N -W-
C 0.10 (0.004) -T- SEATING
PLANE
D
G
H
DETAIL E
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
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High-Speed CMOS Logic Data DL129 -- Rev 6
5
EEE CCC EEE CCC
A -V-
Mfax is a trademark of Motorola, Inc.
MC74HC10A/D MOTOROLA


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